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It is possible to observe cross-sections while observing FIB processing in real time.
A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
![[Data] Cross-sectional observation of solar cell modules](https://image.mono.ipros.com/public/product/image/cc1/2000561879/IPROS02201267418243097889.png?w=280&h=280)
We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!
This document introduces the cross-sectional observation of solar cell modules. An inspection was conducted on a solar cell module that underwent thermal shock testing, and upon performing a cross-sectional observation of the identified abnormal areas, it was confirmed that the interconnector solder joint had fractured. [Contents] - Cross-sectional observation of the fracture - Element map of the fracture *For more details, please refer to the PDF document or feel free to contact us.
Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!
At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.
It is possible to confirm the cross-sectional structure and elemental distribution without damaging fine structures such as grain separation!
We would like to introduce our "Cross-sectional Observation of Automotive Bumper Coating Films." The coating film of automotive bumpers has a multi-layer structure using several types of paint. In general mechanical polishing for cross-sectional observation, issues such as the detachment of added fine particles occur, making it difficult to confirm the correct structure. By using the ion milling method (Ar+ ion beam) for processing, we can observe the cross-sectional structure and elemental distribution without damaging the fine structures such as detachment. 【Features】 ■ SEM observation allows for clear confirmation of the multi-layer structure of the coating film and the added fine particles. ■ By combining elemental analysis, we can clearly confirm the distribution of each added particle. *For more details, please download the PDF or feel free to contact us.
